Plating Technologies for Electroplating Industries. New Plating Technologies for Semiconductor Packaging and Interconnect Technology.

New Packaging and Interconnect Technologies for Ultra Thin Chips

This paper shows different approaches to use the availability of ultrathin chips for the realization of new packages with high density and improved performance. For several years technologies have been developed for the embedding of chips in circuit boards in order to achieve 3D-packages using conventional processes from PCB manufacturing. Ultrathin chips are suited to be integrated in rigid ci...

Advanced Lithography: Nanoimprint Lithography for Semiconductor and Interconnect Technologies

New packaging technologies for the 21st century.

This paper reviews the major influencers that will drive change in meat packaging. A review of the current state of fresh-meat packaging in the US has shown a continued evolution to case ready packaging, with 60% of the packages audited being in the case ready format, versus 49% just two years earlier. Additionally, the market is moving to a higher degree of convenience in the meat case, and re...

investigating the integration of translation technologies into translation programs in iranian universities: basis for a syllabus design in translation technology

today, information technology and computers are indispensable tools of any profession and translation technologies have become an indispensable part of translator’s workstation. with the increasing demands for high productivity and speed as well as consistency and with the rise of new demands for translation and localization, it is necessary for translators to be familiar with market demands an...

Emerging Directions For Packaging Technologies

The continual increasing performance of microelectronics products places a high demand on packaging technologies. Key drivers such as thermal management, power delivery, interconnect density, and integration require novel material development and new package architectures. In this paper, package technology migrations for microprocessors and communication products are described. Material needs f...